Procedure:Techniques

From Project 54/74
Revision as of 22:57, 30 April 2017 by Robertbaruch (talk | contribs)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to: navigation, search
A decapsulated ceramic chip, showing the die. The pins have been cut off or pulled off in preparation for imaging.

Getting from package to schematic goes something like this:

  • Decapsulating, either by heat for ceramic packages, or by hot sulfuric acid for plastic packages.
  • Imaging to photograph the die.
  • Stitching to stitch together the images into one big image.
  • Often, Delayering to remove the glass and metal, if they obscure features, followed by another round of imaging.
  • Annotation of the images to determine the components and their connections.
  • Schematization, which is just using KiCad to draw the schematic.

See Also